RMA-218 Solder Flux Paste (10cc)
This high-viscosity solder flux paste is designed to improve precision and reliability during electronics repair and rework tasks.
It supports cleaner soldering, better ball placement, and smoother assembly processes, helping technicians achieve consistent results while reducing post-work cleanup.
Main Features
- High-viscosity no-clean solder flux paste
- Suitable for BGA rebelling and ball sticking operations
- Supports rework, sphere or pin attachment processes
- Designed for use in consumer electronics repair
- Effective for phone, LED, BGA, SMD, and PGA applications
Specification
- Volume: 10cc
- Certification: CE
- Particle Size: 10–25 μm
This high-viscosity solder flux paste is designed to improve precision and reliability during electronics repair and rework tasks.
It supports cleaner soldering, better ball placement, and smoother assembly processes, helping technicians achieve consistent results while reducing post-work cleanup.
Main Features
- High-viscosity no-clean solder flux paste
- Suitable for BGA rebelling and ball sticking operations
- Supports rework, sphere or pin attachment processes
- Designed for use in consumer electronics repair
- Effective for phone, LED, BGA, SMD, and PGA applications
Specification
- Volume: 10cc
- Certification: CE
- Particle Size: 10–25 μm
Original: $19.86
-65%$19.86
$6.95Description
This high-viscosity solder flux paste is designed to improve precision and reliability during electronics repair and rework tasks.
It supports cleaner soldering, better ball placement, and smoother assembly processes, helping technicians achieve consistent results while reducing post-work cleanup.
Main Features
- High-viscosity no-clean solder flux paste
- Suitable for BGA rebelling and ball sticking operations
- Supports rework, sphere or pin attachment processes
- Designed for use in consumer electronics repair
- Effective for phone, LED, BGA, SMD, and PGA applications
Specification
- Volume: 10cc
- Certification: CE
- Particle Size: 10–25 μm
